Technical Program Committee
Program Committee Co-Chairs-
Alan Wood, Oracle, USA
Min Xie, City U. of Hong Kong, Hong Kong
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Javier Alonso, Duke U, USA
Masayuki Arai, Tokyo Metropolitan U, Japan
Saurabh Bagchi, Purdue U, USA
Jiannong Cao, Hong Kong Polytechnic U, Hong Kong
Domenico Cotroneo, U of Naples Federico II, Italy
Tadashi Dohi, Hiroshima U, Japan
Satoshi Fukumoto, Tokyo Metropolitan U, Japan
Ilir Gashi, CSR, City U of London, UK
Katerina Goseva-Popstojanova, West Virginia U, USA
Myron Hecht, Aerospace Corp, USA
Mick Hobbs, Deakin U, Australia
Masashi Imai, U of Tokyo, Japan
Hidetsugu Irie, U of Electro-Communications, Japan
Nobuyasu Kanekawa, Hitachi, Japan
Dong Seong Kim, U of Canterbury, New Zealand
Masato Kitakami, Grad. School Adv. Integration Sci, Japan
Sy-Yen Kuo, National Taiwan U, Taiwan
Inhwan Lee, Hanyang U, Korea
Xiaowei Li, ICT, China
Yang Liu, National U of Singapore, Singapore
Michael Lyu, Chinese U of Hong Kong, Hong Kong
Hiroshi Nakamura, U of Tokyo, Japan
Manoj Nambiar, Tata Consultancy Services, India
Hiroyuki Okamura, Hiroshima U, Japan
Alex Orailoglu, UC San Diego, USA
Matthieu Roy, LAAS-CNRS, France
Toshinori Sato, Fukuoka U, Japan
Vibhu Sharma, Accenture, USA
Arun Somani, Iowa State U, USA
Ann Tai, WW Technology Group, USA
Dong Tang, Oracle, USA
Kishor Trivedi, Duke U, USA
Tatsuhiro Tsuchiya, Osaka U, Japan
Marco Vieira, DEI-CISUC U of Coimbra, Portugal
Sheng-De Wang, National Taiwan U, Taiwan
Shiyi Xu, Shanghai U, China
Bob Yeh, Boeing, USA
Haruo Yokota, Tokyo Institute of Technology, Japan
Hee Youn, Sungkyunkwan U, Korea
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Kalyan Vaidyanathan, Oracle, USA
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Manoj Balakrishnan, Indian Institute of Space Science and Technology, India
Michael Grottke, Universitat Erlangen-Nurnberg, Germany
Kesari Mishra, NetApp, USA
Srinivasan Ramani, IBM, USA